Continuous report II

During the project was company Reflex Ltd. transformed to Rigaku Innovative Technologies Europe (RITE) which has the same research program and adress.

Abstract:

Report for year 2008 presents results of second year of ESA PECS project "Novel X-ray Optics Technologies for ESA X-ray Astrophysics Missions". Tasks of the second year were accomplished. Results were and will be published in scientific journals and presented at international workshops and conferences (International workshop on Astronomical X-ray optics (AXRO 2008) took place in Prague in November 2008, (please see http://www.axro.org/).

Short summary:

This report presents results of second year of ESA PECS project "Novel X-ray Optics Technologies for ESA X-ray Astrophysics Missions". Tasks of the second year were successfully accomplished. Results were and will be published in scientific journals and presented at international workshops and conferences.

Raman spectroscopy was used as very fast and flexible technique for internal stress measurement. Standard Si wafer, sample with better flatness (compared to standard Si wafer) and thinner sample (compared to standard Si wafer) were compared by this method. A study of residual stress in thin films was also performed because it is one of interesting parameters for this project.

The shape of standard Si wafer is circular but square shape (Si chip) is required for our application. Cutting technologies of Si wafer is critical for next steps of this project, because edge without defects is wanted but Si wafer is single crystal material so edge can split very easily. The next problem is microroughness. The goal is same roughness before and after cutting. Cutting of Si wafer into square Si chip was unexpected obstacle. However large edge defects were removed using above described method.

Proof of principle of one forming technique was tested and preliminary results are promising. In next year we would like to continue with testing of different forming techniques. If results will be promising then first module will be prepared.